Portable optical emission spectrometer E3 ESAPORT

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Dedicated CCD Optical System 

User-Friendly Panel PC 

Special Power Management with battery (optional) for independent running 

Trolley (optional)

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DELO PHOTOBOND AD494 - Glue for glass, PC plastic, transparent

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  • This is a type of acrylate that can be cured by UV and light, high viscosity, suitable for bonding a variety of materials such as glass, PC plastic, PMMA, PA6, PBT, etc.
  • Ingredients: modified acrylate, 1-component adhesive, solvent-free, viscous-modified (thixotropic)

LED PCB Strip X Ray inspection system X1200

1 VND

LED PCB Strip X Ray inspection Solution

It can be effectively tested within the range of 1200mm*600mm

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DELO DUALBOND LT3411 - Adhesive for camera module

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  • This is the glue that is compatible with both UV light and low temperature curing methods (+80oC);
  • The ingredient is just one component based on polycarbaminacid being modified, non-solvent.
  • Non-halogen by the criteria of IEC 61248-2-21;
  • Compliant with RoHS 2015/863/EU;
  • The adhesive is supplied ready to use, to achieve the best performance, it can be dispensed by injection systems or use metal injection needles.
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The components analysis for jewelry ElvaX – Jewelry Lab

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ElvaX Jewelry Lab is aimed at the high-accuracy analysis of jewelry and precious metals.

The measurement process only takes several seconds. The result is shown in both percent share and karats.

ElvaX Jewelry Lab is also capable of detecting coatings and nonstandard alloys. This instrument can be operated either using the embedded computer with the high-resolution touchscreen display or using a PC with ElvaX™ software installed.

Moreover, ElvaX- Jewelry Lab is also integrated print, allow print analysis certificate of chemical components, weight, and price. The device can be used for the battery, makes analysis everywhere, and not depend on the power source or avoid cutoff power socket.

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DELO OB6769 Adhesive for camera module

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  • An adhesive that is compatible with both thermal and UV curing methods;
  • One component adhesive is derived from modified epoxy resin, free-bisphenol A, nonylphenols, CFC / HFC, and solvent-free.
  • Range of use temperature: -40 0C ~ 180 0C, depending on the certain application;
  • Especially for components of the camera module;
  • Combined bonding between PC, PPS, FR4 resins, metal with plastic, metal with metal such as Al / Al, steel/steel,… as well as temperature-sensitive components;
  • Fast fixation of components and details.

 

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DELO® – PUR9694 - PCB Board Adhesive| Epoxy 2 components Adhesive

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  • DELO-PUR9694 is multi-purpose, bonding glass/metal, PBT, PET, and many other materials.
  • Fix components with passivation surfaces (Ferrite, PBT, Al, PET foil), such as coils, capacitors, and plugs, etc. on the FR4 printed circuit board to prevent vibration;
  • The glue has a good resilience to the touch, high strength for both static and dynamic loads, good response to large gaps due to its ability to resist vibration during operation.
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DELO PHOTOBOND 4468 - Metal and Glass Adhesive

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  • It is a UV curing, high viscosity acrylate adhesive, suitable for bonding a variety of materials such as glass, PC plastic, PMMA, PA6, PBT, aluminum, stainless steel, etc. …;
  • Resistant to humidity;
  • Ingredients: modified acrylate, one-component glue, solvent-free, thixotropic;
  • Compliant RoHS standard 2015/863/EU;
  • Achieve certified biosafety standards USP 23, 1995, Class VI Plastics -70 ° C.
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DELO DUALBOND LT354 - Camera Adhesive

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- Specialized glue in gluing electronic components, smartphone camera modules, automotive cameras, ...

- Adhesive to a variety of materials such as glass, aluminum, PC plastic, FR4, GF30, ...

- Ingredients: derived from modified polycarbamin acid, a 1-component glue, no solvents;

- Use in temperature range: -40 0 C ~ 130 0 C, depending on the application; 

- Compliant RoHS standard 2015/863/EU;

- Does not contain halogen elements according to IEC 61249-2-21;

- Compliant with the VOC content limit according to GB33372-2020 regulations;

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DELO MONOPOX HT2999 Thermal-resistant adhesive

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  • DELO MONOPOX HT2999 is a 1-component adhesive, derived from modified epoxy resin, used for applications requiring high-temperature resistance, and good electrical insulation.
  • Comply RoHS standard 2015/863 / EU
  • Use temperature range: from -55 ~ 220 o C
  • Bonding parts and components with high heat generation such as electric motors, drying oven gaskets, test chamber walls, areas that need to be bonded and operated at high temperatures, etc.
  • Applications that require insulation such as in PCB boards, etc.
 

The High Power Burn-in System HPB-4B

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The High Power Burn-in System HPB-4B

Meets the challenge of high-power semiconductor burn-in testing

Chip
CPU
RAM
Circuit board
Microprocessor